IPC-AG is the latest revision of the most widely used electronics assembly standard in the world. IPC AG is now available from lesforgesdessalles.info In May the IPC's Technical Activities Executive Committee (TAEC) adopted Principles of. Standardization as a guiding principle of IPC's standardization. E to F Redline Comparison. Purpose. The visual standards in this document reflect the requirements of existing IPC and other applicable specifications.
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IPC-AE. This redline document is to help users see significant changes from Revision D. New or changed text are shown in blue and underlined like this. IPC-AE Acceptability of Electronic. Assemblies. Developed by the IPC- A development team including Task Group. (b), Task Group Asia. Contractual reference to IPC-A does not additionally impose the content of IPC-AJ- .. 7. Ground. Figure Parallel Connected Wrist Strap E Fig 1.
Defect — Class 2. This page, full color, 5 x 8 inch spiral bound Desk Reference Manual explains electronics assembly to the uninitiated. Where the lug is intended to be soldered beneath the component body and the land is designed for the purpose. Released March This standard is part of the IPC series of standards. Adhesion of wrinkled areas can be verified using a tape pull test.
DRM is included at the request of the publisher, as it helps them protect their copyright by restricting file sharing. Visit FileOpen to see the full list. What you can do with a Secure PDF: October Acceptability of Electronic Assemblies. July Acceptability of Electronic Assemblies. April Acceptability of Electronic Assemblies. February Acceptability of Electronic Assemblies. Damage These criteria are applicable whether leads are formed manually or by machine or die. Designs with via in land may preclude meeting fillet height criteria.
Solder should not extend under the body of surface mount components whose leads are made of Alloy 42 or similar metals. Such restrictions should be identified in drawings. Connections formed to chip components with bottom only terminations shall meet dimensional and solder fillet requirements in Table and 8. The widths of the component termination and land width are W and P.
Wetting is evident. The length of the component termination is R and the length of the land is S.
Table Dimensional Criteria. Unspecified parameter or variable in size. Criteria for tall profile components with bottom only terminations are in 8. Does not violate minimum electrical clearance. Bottom Only Terminations Discrete chip components. Rectangular or Square End Chip Components. Note 8 Terminations Component has 3 or more wettable termination areas on each end. Unspecified dimension. Bottom Only Terminations. Solder connections to components having terminations of a square or rectangular configuration shall meet the dimensional and solder fillet requirements in Table and 8.
Note 6. End Overlap J Acceptable. For 1 sided termination. Notes 7.
The maximum fillet may overhang the land preclude meeting these criteria. Note 6: Designs with open. Note 5: C is measured from the narrowest side of the Note 8: Component size may be larger than if the solder fillet. The maximum fillet may overhang Note Class 3 Acceptable. These criteria may not be acceptable for certain body. Side Joint Length D Target. Minimum Fillet Height F Acceptable.
Termination Variations 8. Termination Variations. Mounting on Side Billboarding This section provides criteria for chip components that may flip rotate onto the narrow edge during assembly. These criteria may not be acceptable for certain high frequency or high vibration applications. Termination Variations — 3Center Terminations These criteria are also applicable to cylindrical chip components with side terminations.
When stacking components. Termination Variations — Stacking These criteria are applicable when stacking is a requirement. Solder connections to components having cylindrical end cap terminations shall meet the dimensional and solder fillet requirements in Table and 8.
Does not apply to components with end-only terminations. The maximum fillet may overhang the land or extend onto the top of the component termination.
Note 7. Designs with via in land may preclude meeting those criteria. Solder acceptance criteria should be defined between the user and the manufacturer. Note 4. C is measured from the narrowest side of the solder fillet.
Note 5. Maximum Fillet Height E. The solder fillet may contact the bottom of the component. Solder Thickness G Acceptable. When lead forming is required.
Solder does not touch package body or end seal. See 8. Fine pitch leads component terminations on less than 0.
In the case of a toe-down lead configuration. Minimum Heel Fillet Height F.
Connections formed to round or flattened coined leads shall meet the dimensional and fillet requirements of Table and 8. Unspecified dimension, or variable in size as determined by design.
In the case of a toe-down lead configuration, the minimum heel fillet height F extends at least to the mid-point of the outside lead bend. J Leads Feature Dim. Solder does not touch package body. Butt connections with modified through-hole leads are not permitted for Class 3 products. Unspecified parameter or variable in size as determined by design.
Maximum fillet may extend into the bend radius. Solder charge 8. Maximum Side Overhang A Target. For Class 1 and 2 product. The top hole of a solder charge termination with two holes is not required to be filled. Post assembly acceptability evaluations should consider the inherent limitation of this component mounting technique to survive operational environments when compared to footed leads or through-hole mounting.
However the design should permit easy inspection of wetting to the wettable surfaces. Connector lead 2. Figure NEW 1.
Land 3. Minimum Side Joint Length D These criteria are applicable only to terminations made with modified through-hole leads. Figure NEW Defect. Figure NEW 8. Maximum Toe Overhang B These criteria are applicable to both modified through-hole leads and solder-charged terminations. Non-conformance to the requirements of Table is a defect. The design should permit easy inspection of wetting to the wettable surfaces.
Solder Thickness G These criteria are applicable only to terminations made with modified through-hole leads. Maximum Fillet Height E These criteria are applicable only to terminations made with modified through-hole leads.
Wetted fillet is evident. Flat Lug Leads Feature Dim. Where the lug is intended to be soldered beneath the component body and the land is designed for the purpose. As a function of the component design. The component solderable termination area does not overhang PCB land area.
Component width 3. Notes 1. Component thickness. Component height 2.
Solder does not contact the component body. Non-conformance to the requirements of Table is a defect.. Designs with via in land may preclude meeting these criteria. Toe 2. Where a lead has 2 prongs. Solder Ball SpacingClearance 8. BGA solder balls contact and wet to the land forming a continuous elliptical round or pillar connection.
Solder connections meet the criteria of 8. To a limited extent. When underfill is required.
Solder is wetted to the solder balls and land terminations. In such cases acceptance criteria shall be established between the manufacturer and user. Soldered Connections a. Voids 8. Voids Voids are not acceptable. Figure Soldered Connections 8. In such cases. Area array process guidance is provided in IPC Under-fill or staking material When required. Non-conformance to the requirements of Tables Plating process induced voids. X-ray equipment that is not intended for electronic assemblies or not properly set up can damage sensitive components.
Visual inspection requirements: Design induced voids. Area array criteria defined herein assumes an inspection process is established to determine compliance for both X-Ray and normal visual inspection processes. Process development and control is essential for continued success of assembly methods and implementation of materials.
Manufacturers may use test or analysis to develop alternate acceptance criteria for voiding that consider the end-use environment. Solder Ball Spacing Acceptable — Class 1. Meet the criteria of 8. Solder Connections Target — Class 1. Voids Design induced voids.
Some package configurations do not have a continuous solderable surface on the sides and do not require a toe end fillet. Acceptance criteria will need to be established between the manufacturer and user. BTC Feature Dim. Connections formed to bottom termination components BTC shall meet dimensional and solder fillet requirements in Table Thermal plane void criteria shall be established between the Manufacturer and User.
Not a visually inspectable attribute. One such example. The mounting and solder requirements for SMT terminations shall meet the criteria for the type of lead termination being used. Connections formed to components with bottom thermal-plane terminations shall meet dimensional and solder fillet requirements in Table Solder wetting is not required on trimmed edges of a thermal plane that expose non-wettable vertical surfaces.
Criteria for non-visible thermal plane solder connections are not described in this document and shall be established by agreement between the user and the manufacturer. The thermal transfer plane acceptance criteria are design and process related. When soldering these types of components voiding in the thermal plane is common. Thermal Plane End Overhang No overhang not shown. Connections formed to flattened post terminations shall meet dimensional and solder fillet requirements in Table and 8.
Criteria have not been established for Class 3 for this termination style. Acceptable — Class 2. No part of the L portion of the termination extends beyond the land. This termination style is typically found on edge mounted connectors that will be soldered on both sides of the board. Connectors need to meet form. A trial mating of connector to connector or to assembly may be required for final acceptance. The requirements relative to wire type.
This section establishes visual acceptability criteria for the installation of discrete wires jumper wires. The following items are addressed: A jumper wire 25 mm [0. Jumper wires are considered as components and are covered by an engineering instruction document for routing. Keep jumper wires as short as practical and unless otherwise documented do not route over or under other replaceable components. For the sake of simplicity only the more common term. Design constraints such as real estate availability and minimum electrical clearance need to be taken into consideration when routing or staking wires.
They may be terminated in plated holes. Wire selection 7.
Gull Wing These criteria are applicable to jumpers attached to leads. SMT — Castellations These criteria are applicable to jumpers attached to castellations. J Lead These criteria are applicable to jumpers attached to leads. SMT -— Land These criteria are applicable to vacant lands. Page 9. Latches 9. Damage to the top surface cover.
Crack integrity. Chip substrate or active element. Burr 2. Plating missing 9. The documentation should identify those particular dimensions. IPC- series. No-Clean Process — Appearance Nicks and Crazing Critical contact area any the portion of the gold areas fingers. Inspection is typically accomplished without magnification or lighting aids.
Scratches Adhesion and Damage Carbonates and White Residues To help identify defect conditions. The identification of laminate defects can be confusing. In addition to providing detailed drawings and photographs to help identify common laminate defects.
See An internal condition occurring in laminated base material in which the glass fibers are separated from the resin at the weave intersections. If the. Crazing at the edge of the board does not reduce the minimum defined distance between board edge and conductive pattern. This condition manifests itself in the form of connected white spots or crosses below the surface of the base material and is usually related to mechanically induced stress.
Haloing and Edge Delamination Haloing. If none is specified. Mechanically induced fracturing or delamination on or below the surface of the base material. Edge Delamination. The maximum haloing or edge delamination is greater than 2. The maximum haloing or edge delamination is not greater than 2. A condition existing in the base material in the form of a light area around holes or other machined areas on or below the surface of the base material. Nicks and Crazing Delamination: A separation between plies within a base material.
Burns Defect — Class 1. There are many new photographs of X-ray or endoscope illustrations to identify some of the characteristics that the industry is experiencing in the implementation of BGA assembly processes as well as void process indicators. The tool also allows for modification of dimensional attributes of IPC approved land patterns. The standard provides printed board designers with an intelligent land pattern naming convention, zero component rotations for CAD systems and three separate land pattern geometries for each component that allow the user to select a land pattern based on desired component density.
The revision also discusses the usage of thermal tabs and provides a new padstack naming convention that addresses the shape and dimensions of lands on different layers of printed boards. For customers and manufacturers, it seems like every company has a unique way of calculating defects and then reporting on quality.
In a complex electronics assembly operation, is it best to calculate using the number of components? The number of leads? What about solder joints? This document is for end-of-process benchmarking. Revision A now provides support for unpopulated terminations and has much clearer examples. This comprehensive component identification resource for electronics assembly operators and inspectors contains colour photographs, computer graphics, schematic symbols and detailed descriptions of more than 50 common through-hole and surface mount components used in electronics assembly today.
Also includes a new section stressing the dangers of cross contamination when using Lead Free components and assemblies. Contains 73 pages in a compact 5. This page, full color, 5 x 8 inch spiral bound Desk Reference Manual explains electronics assembly to the uninitiated. DRM includes over 70 colour photographs and graphic drawings to clearly illustrate assembly technologies in easy to understand terms. Key terms are defined in a glossary — to help simplify the industry lexicon.
Also explains how electronics assembly fits into the electronics industry. Each section includes references for additional training and industry specifications that can provide further information. Students can read at their own pace — study the terminology — and see what everything looks like — all from this concise manual.
With only 38 pages and a compact 5. DRM-SMT also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, solder bridging and disturbed joints, including samples of both tin-lead and lead-free solder connections.
In addition, every change from the D to E revision has been notated to make it easy for your inspectors and operators to learn the new requirements. Using easy-to-understand computer-generated graphics and language geared towards the most basic factory-level employees, this guide will help insure that your company products meet the required industry standards. With only 30 pages and a compact 5. Useful as a training aid in the classroom, or on the shop floor, DRM-PTH-E contains computer generated color illustrations of component, barrel and solder-side perspectives of a plated-through hole.
Each drawing clearly shows the minimum acceptable condition for requirements such as land coverage, vertical fill, wetting of lead, land and barrel and contact angle. DRM-PTH also contains high quality color microphotographs of the major solder defects and conditions such as nonwetting, corrosion, projections, fractures, lead protrusion and disturbed joints with pictures of both tin-lead and lead free solder joints.
Users will better understand the properties of the various conformal coatings, the results to be achieved by its application and how to verify that these goals have been met. Use this document as a supplement in conjunction with the industry standard for qualification and quality conformance of conformal coating, IPC-CCB. Revision J contains nearly new or revised terms, including new terminology for chip scale and area array packaging, cable and wire harness technology, assembly processing, moisture sensitive components, and microvia technology.
Also includes commonly used industry acronyms. Released Focuses on SMT or mixed technology PWAs, specifically addressing the interconnect structure and the solder joint itself.
Discusses substrates, components, attachment materials, coatings and assembly processes and testing considerations. In addition, this document contains detailed appendices covering: It contains techniques for assembly both manual and machines including SMT, BGA and flip chip and consideration of, and impact upon, subsequent soldering, cleaning, and coating processes.
Revised January Coverage is given to adhesion, material qualification, resistances to solvents, and electrical requirements. Revision E incorporates requirements for flexible cover materials used as a flexible dielectric protective layer over etched conductors and other conductive features.
It includes flexible base material specification sheets that have been updated with the newest properties for the specification material types. It establishes the most current classification system, qualification and quality conformance requirements, including high frequency dielectric properties. Provides comprehensive data that will help users more easily determine both material capability and compatibility. IPC includes adhesive-coated flexible dielectric film material specification sheets which are identified by material type.
Provides comprehensive data that will more easily help users determine both material capability and compatibility.
IPC includes the metal-clad dielectric film material specification sheets which are identified by material type. The definitive illustrated guide to printed circuit board acceptability!
Revision B is now available for the only industry-consensus standard for Requirements and Acceptance of Cable and Wire Harness Assemblies. This guide includes everything needed for repair and rework of electronic assemblies and printed circuit boards! J-STDE is recognized worldwide as the sole industry-consensus standard covering soldering materials and processes. This standard prescribes test methods, defect definitions, acceptance criteria and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs.
This standard prescribes general requirements for the classification and characterization of fluxes for high quality solder interconnections. Lists requirements for qualification and characterization of solder paste.